The influence of interconnect line patterns using flat-surface and low-dielectric-loss material under high speed signal propagation

M. Sugimura, H. Imai, M. Nakayama, M. Kawasaki, M. Fujimura, H. Oonuki, O. Kawashima, A. Morimoto, A. Teramoto, S. Sugawa, T. Ohmi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

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Engineering & Materials Science

Chemical Compounds