The high speed collision induced ultrahard recrystallized pure Ni

Lv Jinlong, Cheng Lei, Wang Zhuqing, Hideo Miura

Research output: Contribution to journalArticlepeer-review

Abstract

The microstructures and strength of pure Ni ball after high speed collision process were investigated. The elongated and equiaxed nanocrystallines with high angle grain boundaries and random grain orientation were formed near the interface position due to high strain and strain rate. Sufficient intragranular recrystallization occurred due to shock induced storage energy. Sufficient recrystallization in the grain interior facilitated to activate dislocation in the process of subsequent deformation and resulted in ameliorated hardness. Moreover, the high angle grain boundaries could effectively impede the dislocation movement, which also significantly enhanced the strength of Ni ball near the interface.

Original languageEnglish
Pages (from-to)349-353
Number of pages5
JournalMaterials Science and Engineering A
Volume736
DOIs
Publication statusPublished - 2018 Oct 24

Keywords

  • High angle boundaries
  • High speed collision
  • Nanocrystallines
  • Nickel
  • Strength

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

Fingerprint Dive into the research topics of 'The high speed collision induced ultrahard recrystallized pure Ni'. Together they form a unique fingerprint.

Cite this