The effects of Cr oxidation and polyimide degradation on interface adhesion strength in Cu/Cr/polyimide flexible films

T. Miyamura, J. Koike

Research output: Contribution to journalArticlepeer-review

35 Citations (Scopus)

Abstract

Interface adhesion strength of Cu/Cr/polyimide was measured and the effects of annealing atmosphere were investigated. Adhesion strength decreased after annealing in vacuum by 25% and in air by 41%, which was attributed, respectively, to broken carbonyl bonds and to the formation of Cr oxide. Failure mode changed accordingly from cohesive to interfacial at a Cr/polyimide interface.

Original languageEnglish
Pages (from-to)620-624
Number of pages5
JournalMaterials Science and Engineering A
Volume445-446
DOIs
Publication statusPublished - 2007 Feb 15

Keywords

  • Copper
  • Degradation
  • Interface
  • Oxidation
  • Polyimide
  • Strength

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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