The effect of carrier conduction between main chains on thermoelectric properties of polythiophene

Y. Shinohara, Y. Isoda, Y. Imai, K. Hiraishi, H. Oikawa, H. Nakanishi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Citations (Scopus)

Abstract

Polythiophene films were synthesized by electrolytic polymerization using nitrobenzene as a solvent and tetra-n-butylammonium perchrorate as an electrolyte. We have evaluated thermoelectric properties of Seebeck coefficient, electrical conductivity, hall mobility and career concentration of the films in the in-plane direction. The films showed a tendency that Seebeck coefficient decreased with an increasing electrical conductivity. The figure-of-merit was calculated assuming the thermal conductivity was 0.1W/Km. The figure-of-merit increased with an increasing electrical conductivity up to 1.5×10 -4/K. The electrical conductivity was mainly changed with Hall mobility, which was related to molecular spacing of the mains chains. Variable range hopping was a determining process of carrier conduction. The easiness of carrier conduction between main chain molecules directly affected the figure-of-merit of the polythiophene polymers.

Original languageEnglish
Title of host publicationProceedings ICT'07 - 26th International Conference on Thermoelectrics
Pages405-407
Number of pages3
DOIs
Publication statusPublished - 2007 Dec 1
EventICT'07 - 26th International Conference on Thermoelectrics - Jeju, Korea, Republic of
Duration: 2007 Jun 32007 Jun 7

Publication series

NameInternational Conference on Thermoelectrics, ICT, Proceedings

Other

OtherICT'07 - 26th International Conference on Thermoelectrics
CountryKorea, Republic of
CityJeju
Period07/6/307/6/7

ASJC Scopus subject areas

  • Engineering(all)

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  • Cite this

    Shinohara, Y., Isoda, Y., Imai, Y., Hiraishi, K., Oikawa, H., & Nakanishi, H. (2007). The effect of carrier conduction between main chains on thermoelectric properties of polythiophene. In Proceedings ICT'07 - 26th International Conference on Thermoelectrics (pp. 405-407). [4569506] (International Conference on Thermoelectrics, ICT, Proceedings). https://doi.org/10.1109/ICT.2007.4569506