The degradation prevention of resin materials for semiconductor manufacturing equipment by applying the ultra-high purity gas supply technology

Atsushi Hidaka, Satoru Yamashita, Naoki Tanahashi, Hidekazu Ishii, Masafumi Kitano, Yasuyuki Shirai, Tadahiro Ohrni

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The production (molding) guideline to realize uhraclean resin components for semiconductor equipment has been established In this paper, we focused on the degradation behavior of resin materials for the purpose of reducing low-molecular-weight volatile contaminants concentration in resin components because the molding is carried out at high temperature and low-molecular-weight volatile contaminants are produced by thermal degradation. It was clarified that die oxygen concentration in high temperature molding environment is required to be below 1 ppm. And as the contact surface of the thermal degradation prevention for the resin material, the following surface materials are effective. 1) Passivation surface for a hydrocarbon resin. 2) Ni (nickel) surface for a fluorocarbon resin. As a result, we found the degradation prevention of the resin material can be realized until around 400°C although the degradation was observed even under 200 C if using current process condition. Therefore, low-molecular-weight volatile contaminants can be drastically reduced from resin components by using the guideline and uhraclean semiconductor equipment must be realized.

Original languageEnglish
Title of host publicationUltra Clean Processing of Silicon Surfaces VII, UCPSS 2004 - Proceedings of the 7th International Symposium on Ultra Clean Processing of Silicon Surfaces (UCPSS)
PublisherTrans Tech Publications Ltd
Pages255-258
Number of pages4
ISBN (Print)390845106X, 9783908451068
DOIs
Publication statusPublished - 2005 Jan 1
Event7th International Symposium on Ultra Clean Processing of Silicon Surfaces, UCPSS 2004 - Brussels, Belgium
Duration: 2004 Sep 202004 Sep 22

Publication series

NameSolid State Phenomena
Volume103-104
ISSN (Print)1012-0394

Other

Other7th International Symposium on Ultra Clean Processing of Silicon Surfaces, UCPSS 2004
CountryBelgium
CityBrussels
Period04/9/2004/9/22

Keywords

  • Degradation prevention
  • Molding environment
  • Organic contaminants
  • Resin materials

ASJC Scopus subject areas

  • Atomic and Molecular Physics, and Optics
  • Materials Science(all)
  • Condensed Matter Physics

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  • Cite this

    Hidaka, A., Yamashita, S., Tanahashi, N., Ishii, H., Kitano, M., Shirai, Y., & Ohrni, T. (2005). The degradation prevention of resin materials for semiconductor manufacturing equipment by applying the ultra-high purity gas supply technology. In Ultra Clean Processing of Silicon Surfaces VII, UCPSS 2004 - Proceedings of the 7th International Symposium on Ultra Clean Processing of Silicon Surfaces (UCPSS) (pp. 255-258). (Solid State Phenomena; Vol. 103-104). Trans Tech Publications Ltd. https://doi.org/10.4028/3-908451-06-x.255