The characterization of creep crack growth rate and its life of TiAl inter-metallic compound with full lamellar microstructure

Toshimitsu Yokobori, Tsuyoshi Satoh, Masayuki Shibata, Masaaki Tabuchi, Akio Fuji, Takeo Yokobori

    Research output: Contribution to journalArticle

    5 Citations (Scopus)

    Abstract

    TiAl inter-metallic compound is considered to be an effective material for high temperature structural materials. Since, this material is considered to be a creep brittle like material, it is necessary to construct the prediction law for the life of creep crack growth. The introduction of a fatigue pre-crack was found to be difficult due to material structure. Therefore, the validity of using a sharp-notched specimen (machined or EDM) instead of a fatigue pre-cracked specimen to perform creep crack growth rate test (CCGR test) has been proposed. In this paper, creep crack growth tests were conducted for this material using CT specimens with a sharp notch. On the basis of a thermally activated process, CCGR of TiAl inter-metallic compound with full lamellar microstructure was characterized in terms of temperature and stress component and Q* parameter for this material is derived. Furthermore, the algorithm of predicting the life of creep crack growth based on the Q* parameter was derived. This equation was found to well predict the life of creep crack growth.

    Original languageEnglish
    Pages (from-to)757-764
    Number of pages8
    JournalInternational Journal of Pressure Vessels and Piping
    Volume78
    Issue number11-12
    Publication statusPublished - 2001 Dec 1

    Keywords

    • Creep crack growth rate
    • Full lamellar structure
    • Sharp-notched specimen
    • The life of creep crack growth
    • TiAl inter-metallic compound

    ASJC Scopus subject areas

    • Materials Science(all)
    • Mechanics of Materials
    • Mechanical Engineering

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