Test chip fabrication of 3D optically coupled common memory for parallel processing system

Mitsumasa Koyanagi, Koji Miyake, Shin Yokoyama, Masataka Hirose, Tadashi Ae, Yasuhiro Horiike

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

We have proposed a new three-dimensional optically coupled common memory (3D-OCC memory) to solve the problem of bus bottle neck in the multi-processor system with the shared memories. Three- dimensional-OCC memory consists of several memory layers vertically stacked and a block of data is simultaneously transferred among these memories using vertically optical interconnection. Three-dimensional-OCC memory acts as the real shared memory. Three-dimensional-OCC memory test chip has been fabricated using 2 μm CMOS technology. LEDs are integrated on the silicon test chip by using a newly developed micro-bonding technology. We observed the uniform photon emission from these LEDs. In addition, the basic operation of 3D-OCC memory for optical writing/electrical reading was confirmed using this test chip.

Original languageEnglish
Title of host publicationProceedings of SPIE - The International Society for Optical Engineering
PublisherSociety of Photo-Optical Instrumentation Engineers
Pages8-15
Number of pages8
ISBN (Print)0819417475
Publication statusPublished - 1995 Jan 1
EventOptoelectronic Interconnects III - San Jose, CA, USA
Duration: 1995 Feb 81995 Feb 9

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
Volume2400
ISSN (Print)0277-786X

Other

OtherOptoelectronic Interconnects III
CitySan Jose, CA, USA
Period95/2/895/2/9

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

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  • Cite this

    Koyanagi, M., Miyake, K., Yokoyama, S., Hirose, M., Ae, T., & Horiike, Y. (1995). Test chip fabrication of 3D optically coupled common memory for parallel processing system. In Proceedings of SPIE - The International Society for Optical Engineering (pp. 8-15). (Proceedings of SPIE - The International Society for Optical Engineering; Vol. 2400). Society of Photo-Optical Instrumentation Engineers.