Temperature Distribution in IC Plastic Packages in the Reflow Soldering Process

Hideo Miura, Asao Nishimura, Sueo Kawai, Wataru Nakayama

Research output: Contribution to journalArticlepeer-review

11 Citations (Scopus)

Abstract

The temperature distribution in IC plastic packages in the reflow soldering process was discussed by both an experimental method and an analytical method. The temperature sensor composed of a p-n junction diode was embedded in a silicon chip and the chip was molded in an actual plastic package to measure the chip temperature in the soldering process. Temperature variations of the chip during the dip-coating process, the vapor phase reflow soldering, and the infrared reflow soldering were obtained. The FEM (finite-element method) analysis was performed to develop an effective method for estimating the temperature distribution in the package. It is found that the combination of laboratory experiment, proper modeling of thermal boundary condition for the package, and FEM analysis is an effective scheme to find a satisfactory operative condition for a soldering process.

Original languageEnglish
Pages (from-to)499-505
Number of pages7
JournalIEEE Transactions on Components, Hybrids, and Manufacturing Technology
Volume11
Issue number4
DOIs
Publication statusPublished - 1988 Dec
Externally publishedYes

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Engineering(all)
  • Industrial and Manufacturing Engineering
  • Electrical and Electronic Engineering

Fingerprint Dive into the research topics of 'Temperature Distribution in IC Plastic Packages in the Reflow Soldering Process'. Together they form a unique fingerprint.

Cite this