Temperature distribution in IC plastic packages in the reflow soldering process.

Hideo Miura, Asao Nishimura, Sueo Kawai, Wataru Nakayama

Research output: Contribution to conferencePaperpeer-review

Abstract

Temperature distribution in the packages is evaluated by both experimental method and an analytical finite-element method (FEM). It is found that the FEM analysis is useful for the temperature estimation of the packages. Temperature sensors imbedded in silicon chips were used to measure the temperature distribution in the package in both the reflow soldering process and the dip-coating process. These sensor chips were encapsulated in the actual DIP (dual in-line package) type package and SOJ (small outline j-bend package) type package. Temperature distributions of these packages were measured under various soldering conditions.

Original languageEnglish
Pages50-59
Number of pages10
Publication statusPublished - 1988 Dec 1
Externally publishedYes

ASJC Scopus subject areas

  • Engineering(all)

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