TEM study of electrode structure formed by electroless plating

Kazuhiko Matsumura, Tetsuo Kawakita, Masaaki Niwa

Research output: Contribution to conferencePaperpeer-review

Abstract

Micro-structure of a electroless Au/Ni bump on Al electrode has been studied to clarify a degradation mechanism of sticking ability between Al and Ni which directly causes an increase of a contact resistance at the electrode in ULSI. We have clarified that the Ni film formed by the electroless plating is an amorphous or amorphous like micro-crystal and the Ni near the Au/Ni interface seems to have a lamella structure. Also, a highly oriented crystal Au exists in a grain boundaries among the electroless Ni film. In addition, we have demonstrated the presence of an amorphous phase between the Ni and the Al electrode interface for the first time. These results explain the reason of the degradation of sticking ability between the Al electrode and the electroless Ni film.

Original languageEnglish
Pages215-219
Number of pages5
Publication statusPublished - 1997 Jan 1
Externally publishedYes
EventProceedings of the 1997 IEEE/CPMT 20th International Electronic Manufacturing Symposium - Tokyo, Jpn
Duration: 1997 Apr 161997 Apr 18

Other

OtherProceedings of the 1997 IEEE/CPMT 20th International Electronic Manufacturing Symposium
CityTokyo, Jpn
Period97/4/1697/4/18

ASJC Scopus subject areas

  • Industrial and Manufacturing Engineering
  • Electrical and Electronic Engineering

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