Technologies for Power Device Packaging by using Solid Liquid Interdiffusion Bonding - SLID

Mario Baum; Jörg Frömel; Christian Hofmann; Maik Wiemer; Karla Hiller; Harald Kuhn

doi:10.1109/ICSJ52620.2021.9648906

Technologies for Power Device Packaging by using Solid Liquid Interdiffusion Bonding - SLID

Mario Baum, Jörg Frömel, Christian Hofmann, Maik Wiemer, Karla Hiller, Harald Kuhn

Advanced Institute for Materials Research (AIMR)

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

This paper presents several approaches for bonding at low temperature with a resulting interface alloy that is stable at temperatures higher than the bonding temperature itself. The bonding principle described herewith is called Solid Liquid Interdiffusion (SLID) bonding, where two metals were used for creating an alloy. First, a low melting point metal defines the process temperature e. g. Sn, In, or Ga. With a high solubility, a second metal forms together with the first metal intermetallic phase(s) during isothermal solidification. By the concentration and the stoichiometric relation of the components the liquid phase while bonding is mainly controlled. This paper will show different material combinations and different deposition technologies for the metals used with regard to efficient fabrication processes.

Original language	English
Title of host publication	2021 IEEE CPMT Symposium Japan, ICSJ 2021
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	31-32
Number of pages	2
ISBN (Electronic)	9781665440790
DOIs	https://doi.org/10.1109/ICSJ52620.2021.9648906
Publication status	Published - 2021
Event	10th IEEE CPMT Symposium Japan, ICSJ 2021 - Kyoto, Japan Duration: 2021 Nov 10 → 2021 Nov 12

Publication series

Name	2021 IEEE CPMT Symposium Japan, ICSJ 2021

Conference

Conference	10th IEEE CPMT Symposium Japan, ICSJ 2021
Country/Territory	Japan
City	Kyoto
Period	21/11/10 → 21/11/12

Keywords

Deposition
Inductive heating
Joining
Low temperature
SLID
Solid liquid interdiffusion
Wafer bonding

ASJC Scopus subject areas

Instrumentation
Atomic and Molecular Physics, and Optics
Computer Networks and Communications
Control and Systems Engineering
Electrical and Electronic Engineering
Electronic, Optical and Magnetic Materials

Access to Document

10.1109/ICSJ52620.2021.9648906

Cite this

Baum, M., Frömel, J., Hofmann, C., Wiemer, M., Hiller, K., & Kuhn, H. (2021). Technologies for Power Device Packaging by using Solid Liquid Interdiffusion Bonding - SLID. In 2021 IEEE CPMT Symposium Japan, ICSJ 2021 (pp. 31-32). (2021 IEEE CPMT Symposium Japan, ICSJ 2021). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ICSJ52620.2021.9648906

Technologies for Power Device Packaging by using Solid Liquid Interdiffusion Bonding - SLID. / Baum, Mario; Frömel, Jörg; Hofmann, Christian et al.

2021 IEEE CPMT Symposium Japan, ICSJ 2021. Institute of Electrical and Electronics Engineers Inc., 2021. p. 31-32 (2021 IEEE CPMT Symposium Japan, ICSJ 2021).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Baum, M, Frömel, J, Hofmann, C, Wiemer, M, Hiller, K & Kuhn, H 2021, Technologies for Power Device Packaging by using Solid Liquid Interdiffusion Bonding - SLID. in 2021 IEEE CPMT Symposium Japan, ICSJ 2021. 2021 IEEE CPMT Symposium Japan, ICSJ 2021, Institute of Electrical and Electronics Engineers Inc., pp. 31-32, 10th IEEE CPMT Symposium Japan, ICSJ 2021, Kyoto, Japan, 21/11/10. https://doi.org/10.1109/ICSJ52620.2021.9648906

@inproceedings{4750b52324dd4f03bc95412d77ea327b,

title = "Technologies for Power Device Packaging by using Solid Liquid Interdiffusion Bonding - SLID",

abstract = "This paper presents several approaches for bonding at low temperature with a resulting interface alloy that is stable at temperatures higher than the bonding temperature itself. The bonding principle described herewith is called Solid Liquid Interdiffusion (SLID) bonding, where two metals were used for creating an alloy. First, a low melting point metal defines the process temperature e. g. Sn, In, or Ga. With a high solubility, a second metal forms together with the first metal intermetallic phase(s) during isothermal solidification. By the concentration and the stoichiometric relation of the components the liquid phase while bonding is mainly controlled. This paper will show different material combinations and different deposition technologies for the metals used with regard to efficient fabrication processes.",

keywords = "Deposition, Inductive heating, Joining, Low temperature, SLID, Solid liquid interdiffusion, Wafer bonding",

author = "Mario Baum and J{\"o}rg Fr{\"o}mel and Christian Hofmann and Maik Wiemer and Karla Hiller and Harald Kuhn",

note = "Publisher Copyright: {\textcopyright} 2021 IEEE.; 10th IEEE CPMT Symposium Japan, ICSJ 2021 ; Conference date: 10-11-2021 Through 12-11-2021",

year = "2021",

doi = "10.1109/ICSJ52620.2021.9648906",

language = "English",

series = "2021 IEEE CPMT Symposium Japan, ICSJ 2021",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "31--32",

booktitle = "2021 IEEE CPMT Symposium Japan, ICSJ 2021",

}

TY - GEN

T1 - Technologies for Power Device Packaging by using Solid Liquid Interdiffusion Bonding - SLID

AU - Baum, Mario

AU - Frömel, Jörg

AU - Hofmann, Christian

AU - Wiemer, Maik

AU - Hiller, Karla

AU - Kuhn, Harald

PY - 2021

Y1 - 2021

N2 - This paper presents several approaches for bonding at low temperature with a resulting interface alloy that is stable at temperatures higher than the bonding temperature itself. The bonding principle described herewith is called Solid Liquid Interdiffusion (SLID) bonding, where two metals were used for creating an alloy. First, a low melting point metal defines the process temperature e. g. Sn, In, or Ga. With a high solubility, a second metal forms together with the first metal intermetallic phase(s) during isothermal solidification. By the concentration and the stoichiometric relation of the components the liquid phase while bonding is mainly controlled. This paper will show different material combinations and different deposition technologies for the metals used with regard to efficient fabrication processes.

AB - This paper presents several approaches for bonding at low temperature with a resulting interface alloy that is stable at temperatures higher than the bonding temperature itself. The bonding principle described herewith is called Solid Liquid Interdiffusion (SLID) bonding, where two metals were used for creating an alloy. First, a low melting point metal defines the process temperature e. g. Sn, In, or Ga. With a high solubility, a second metal forms together with the first metal intermetallic phase(s) during isothermal solidification. By the concentration and the stoichiometric relation of the components the liquid phase while bonding is mainly controlled. This paper will show different material combinations and different deposition technologies for the metals used with regard to efficient fabrication processes.

KW - Deposition

KW - Inductive heating

KW - Joining

KW - Low temperature

KW - SLID

KW - Solid liquid interdiffusion

KW - Wafer bonding

UR - http://www.scopus.com/inward/record.url?scp=85124199743&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85124199743&partnerID=8YFLogxK

U2 - 10.1109/ICSJ52620.2021.9648906

DO - 10.1109/ICSJ52620.2021.9648906

M3 - Conference contribution

AN - SCOPUS:85124199743

T3 - 2021 IEEE CPMT Symposium Japan, ICSJ 2021

SP - 31

EP - 32

BT - 2021 IEEE CPMT Symposium Japan, ICSJ 2021

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 10th IEEE CPMT Symposium Japan, ICSJ 2021

Y2 - 10 November 2021 through 12 November 2021

ER -

Technologies for Power Device Packaging by using Solid Liquid Interdiffusion Bonding - SLID

Abstract

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Keywords

ASJC Scopus subject areas

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