Technological platform for vertical multi-wafer integration of microscanners and micro-optical components

Sylwester Bargiel, Maciej Baranski, Maik Wiemer, Jörg Frömel, Wei Shan Wang, Christophe Gorecki

Research output: Contribution to journalArticlepeer-review

2 Citations (Scopus)


We describe an original integration technological platform for the miniaturization of micromachined on-chip optical microscopes, such as the laser scanning confocal microscope. The platform employs the multi-wafer vertical integration approach, combined with integrated glass-based micro-optics as well as micro-electro-mechanical systems (MEMS) components, where the assembly uses the heterogeneous bonding and interconnecting technologies. Various heterogeneous components are disposed in vertically stacked building blocks (glass microlens, MEMS actuator, beamsplitter, etc.) in a minimum space. The platform offers the integrity and potential of MEMS microactuators integrated with micro-optics, providing miniaturized and low cost solutions to create micromachined on-chip optical microscopes.

Original languageEnglish
Article number185
Issue number3
Publication statusPublished - 2019
Externally publishedYes


  • Confocal microscopy
  • Micro-optics
  • Multi-wafer bonding
  • Vertical integration

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Mechanical Engineering
  • Electrical and Electronic Engineering


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