Technological platform for vertical multi-wafer integration of miniature imaging instruments

S. Bargiel, M. Baranski, N. Passilly, C. Gorecki, M. Wiemer, J. Frömel, D. Wünsch, W. S. Wang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

We describe a technological platform developed for miniaturization of optical imaging instruments, such as laser scanning confocal microscopes or Optical Coherence Tomography devices. The platform employs multi-wafer vertical integration approach, combined with integrated glass-based micro-optics and heterogeneous bonding and interconnecting technologies. In this paper we focus on the unconventional fabrication methods of monolithic micro-optical structures and components in borosilicate glass (e.g. micro beamsplitters, refractive microlenses) for optical beam shaping and routing. In addition, we present hybrid laser-assisted integration of glass ball microlenses on the silicon MEMS actuators for transmissive beam scanning as well as methods of electrical signals distribution through thick glass substrates, based on HF etched via holes.

Original languageEnglish
Title of host publicationMOEMS and Miniaturized Systems XIV
EditorsYong-Hwa Park, Wibool Piyawattanametha
PublisherSPIE
ISBN (Electronic)9781628414653
DOIs
Publication statusPublished - 2015 Jan 1
Externally publishedYes
EventMOEMS and Miniaturized Systems XIV - San Francisco, United States
Duration: 2015 Feb 92015 Feb 12

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
Volume9375
ISSN (Print)0277-786X
ISSN (Electronic)1996-756X

Other

OtherMOEMS and Miniaturized Systems XIV
CountryUnited States
CitySan Francisco
Period15/2/915/2/12

Keywords

  • 3-D scanning
  • Confocal microscopy
  • Imaging systems
  • MOEMS
  • Micro-optics
  • Microlens Scanner
  • Microlens integration
  • Multi-wafer Bonding
  • Optical Coherence Tomography
  • Vertical integration

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

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