Technical trend of packaging for power semiconductor modules

Yoshikazu Takahashi, Akira Morozumi, Yoshinari Ikeda, Yoshitaka Nishimura

Research output: Contribution to journalArticlepeer-review

1 Citation (Scopus)
Original languageEnglish
Pages (from-to)341-346
Number of pages6
JournalJournal of Japan Institute of Electronics Packaging
Volume16
Issue number5
DOIs
Publication statusPublished - 2013 Jan 1
Externally publishedYes

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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