Tearing Modulus Tw and Its Evaluation Based on Stress-Strain Fields Near a Growing Crack Tip

Masumi Saka, Tetsuo Shoji, Hideaki Takahashi, Hiroyuki Abé

Research output: Contribution to journalArticlepeer-review

Original languageEnglish
Pages (from-to)166-171
Number of pages6
JournalNihon Kikai Gakkai Ronbunshu, A Hen/Transactions of the Japan Society of Mechanical Engineers, Part A
Volume49
Issue number438
DOIs
Publication statusPublished - 1983

Keywords

  • Crack Tip Stress-Strain Fields
  • Fracture
  • Growing Crack
  • Rate of Crack Tip Energy Dissipation
  • Tearing Modulus

ASJC Scopus subject areas

  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering

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