Tactile Sensing System Module with Multiple Cmos-Mems Integrated Sensors on 16 Mbps High Speed Shared Serial Bus Line

Chenzhong Shao, Hideki Hirano, Munetaka Nomoto, Hiroshi Miyaguchi, Takahiro Nakayama, Yoshiyuki Hata, Motohiro Fujiyoshi, Masanori Muroyama, Shuji Tanaka

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Abstract

This paper presents a PCB-based system module including 5 CMOS-MEMS integrated sensors for robot fingertip tactile sensing. The sensor used in the module has 3-axis capacitive force sensation with 2.7 mm square footprint and integrates our original sensor platform LSI fabricated by TSMC0.13μm CMOS process. Five integrated sensors are mounted on a shared serial bus with a high-dense pitch of 9 mm and communicate with an FPGA-based relay node through RS-485 compatible differential signaling. We confirmed that these 5 integrated sensors operated simultaneously on the serial bus with a high data rate up to 16 Mbps.

Original languageEnglish
Title of host publication2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages562-565
Number of pages4
ISBN (Electronic)9781728120072
DOIs
Publication statusPublished - 2019 Jun
Event20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII - Berlin, Germany
Duration: 2019 Jun 232019 Jun 27

Publication series

Name2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII

Conference

Conference20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII
Country/TerritoryGermany
CityBerlin
Period19/6/2319/6/27

Keywords

  • CMOS-MEMS integration
  • Differential signaling
  • Sensor platform LSI
  • Serial bus communication
  • Tactile sensing system
  • Tactile sensor

ASJC Scopus subject areas

  • Process Chemistry and Technology
  • Spectroscopy
  • Electrical and Electronic Engineering
  • Mechanical Engineering
  • Electronic, Optical and Magnetic Materials
  • Control and Optimization
  • Instrumentation

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