Tactile Sensing From Backside of Flexible Printed Circuit Using LSI-Integrated Sensor with Elastic Dome Structure

Tatsuki Teranishi, Hideki Hirano, Shuji Tanaka

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper presents a new configuration of CMOS-LSI integrated tactile sensor flip-chip-bonded on a flexible printed circuit (FPC) in a standard face-down manner. The tactile sensors receive force from the backside of the FPC through an elastic dome structure. Device layer transfer process using fly-cut planarized metal bonding technology was developed for the LSI-MEMS integration. The fabrication of this configuration is much easier than that of the previous one, where an LSI-integrated sensor is connected to the FPC in a face-up manner via through-silicon vias (TSVs) in the LSI. In addition, the sensitivity of the integrated sensor can be adjusted by optimizing elastic modulus of a dome structure, which is made by molding. Finally, the operation of the total system was successfully confirmed.

Original languageEnglish
Title of host publication2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages547-550
Number of pages4
ISBN (Electronic)9781728120072
DOIs
Publication statusPublished - 2019 Jun
Event20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII - Berlin, Germany
Duration: 2019 Jun 232019 Jun 27

Publication series

Name2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII

Conference

Conference20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII
CountryGermany
CityBerlin
Period19/6/2319/6/27

Keywords

  • CMOS-MEMS integration
  • Elastic dome structure
  • Flexible printed circuit
  • Metal bonding
  • PDMS
  • Serial bus network
  • Tactile sensor

ASJC Scopus subject areas

  • Process Chemistry and Technology
  • Spectroscopy
  • Electrical and Electronic Engineering
  • Mechanical Engineering
  • Electronic, Optical and Magnetic Materials
  • Control and Optimization
  • Instrumentation

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