Synthesis and characterization of carbon nanotube-Cu composite using supercritical fluid deposition

Research output: Contribution to journalArticle

Abstract

We propose a new approach to synthesize a carbon nanotube (CNT) - copper (Cu) composite on a silicon substrate using combination of supercritical fluid deposition (SCFD) and electrochemical plating (ECP) process. The measured density of the composite is 8.2 ± 0.3 g/cm3, and the volume percentage of voids is 3~6%. The evaluated thermal resistance including the thermal interface resistance and bulk resistance of the composite is 28.4~42.1 mm2 KW-1. It shows the potential ability of the CNTs-Cu composite for thermal interface material.

Original languageEnglish
Pages (from-to)38-39
Number of pages2
JournalIEEJ Transactions on Sensors and Micromachines
Volume134
Issue number2
DOIs
Publication statusPublished - 2014 Feb 10

Keywords

  • Carbon nanotubes-Cu composite
  • Supercritical fluid deposition
  • Thermal interface resistance

ASJC Scopus subject areas

  • Mechanical Engineering
  • Electrical and Electronic Engineering

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