Synthesis and characterization of carbon nanotube-Cu composite using supercritical fluid deposition

Zhonglie An; Masaya Toda; Takahito Ono

doi:10.1541/ieejsmas.134.38

Synthesis and characterization of carbon nanotube-Cu composite using supercritical fluid deposition

Zhonglie An, Masaya Toda, Takahito Ono

ENG - Mechanical Systems Engineering

Research output: Contribution to journal › Article › peer-review

Abstract

We propose a new approach to synthesize a carbon nanotube (CNT) - copper (Cu) composite on a silicon substrate using combination of supercritical fluid deposition (SCFD) and electrochemical plating (ECP) process. The measured density of the composite is 8.2 ± 0.3 g/cm³, and the volume percentage of voids is 3~6%. The evaluated thermal resistance including the thermal interface resistance and bulk resistance of the composite is 28.4~42.1 mm² KW^-1. It shows the potential ability of the CNTs-Cu composite for thermal interface material.

Original language	English
Pages (from-to)	38-39
Number of pages	2
Journal	IEEJ Transactions on Sensors and Micromachines
Volume	134
Issue number	2
DOIs	https://doi.org/10.1541/ieejsmas.134.38
Publication status	Published - 2014

Keywords

Carbon nanotubes-Cu composite
Supercritical fluid deposition
Thermal interface resistance

ASJC Scopus subject areas

Mechanical Engineering
Electrical and Electronic Engineering

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title = "Synthesis and characterization of carbon nanotube-Cu composite using supercritical fluid deposition",

abstract = "We propose a new approach to synthesize a carbon nanotube (CNT) - copper (Cu) composite on a silicon substrate using combination of supercritical fluid deposition (SCFD) and electrochemical plating (ECP) process. The measured density of the composite is 8.2 ± 0.3 g/cm3, and the volume percentage of voids is 3~6%. The evaluated thermal resistance including the thermal interface resistance and bulk resistance of the composite is 28.4~42.1 mm2 KW-1. It shows the potential ability of the CNTs-Cu composite for thermal interface material.",

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AU - Toda, Masaya

AU - Ono, Takahito

PY - 2014

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N2 - We propose a new approach to synthesize a carbon nanotube (CNT) - copper (Cu) composite on a silicon substrate using combination of supercritical fluid deposition (SCFD) and electrochemical plating (ECP) process. The measured density of the composite is 8.2 ± 0.3 g/cm3, and the volume percentage of voids is 3~6%. The evaluated thermal resistance including the thermal interface resistance and bulk resistance of the composite is 28.4~42.1 mm2 KW-1. It shows the potential ability of the CNTs-Cu composite for thermal interface material.

AB - We propose a new approach to synthesize a carbon nanotube (CNT) - copper (Cu) composite on a silicon substrate using combination of supercritical fluid deposition (SCFD) and electrochemical plating (ECP) process. The measured density of the composite is 8.2 ± 0.3 g/cm3, and the volume percentage of voids is 3~6%. The evaluated thermal resistance including the thermal interface resistance and bulk resistance of the composite is 28.4~42.1 mm2 KW-1. It shows the potential ability of the CNTs-Cu composite for thermal interface material.

KW - Carbon nanotubes-Cu composite

KW - Supercritical fluid deposition

KW - Thermal interface resistance

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Synthesis and characterization of carbon nanotube-Cu composite using supercritical fluid deposition

Abstract

Keywords

ASJC Scopus subject areas

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