We propose a new approach to synthesize a carbon nanotube (CNT) - copper (Cu) composite on a silicon substrate using combination of supercritical fluid deposition (SCFD) and electrochemical plating (ECP) process. The measured density of the composite is 8.2 ± 0.3 g/cm3, and the volume percentage of voids is 3~6%. The evaluated thermal resistance including the thermal interface resistance and bulk resistance of the composite is 28.4~42.1 mm2 KW-1. It shows the potential ability of the CNTs-Cu composite for thermal interface material.
- Carbon nanotubes-Cu composite
- Supercritical fluid deposition
- Thermal interface resistance
ASJC Scopus subject areas
- Mechanical Engineering
- Electrical and Electronic Engineering