Synchronous schlieren image analysis of megasonic single wafer cleaning

Takashi Azuma, Akihiro Tomozawa, Hideo Kinoshita, Shinichiro Umemura

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A synchronous Schlieren system for quantitative analysis of the ultrasonic field in megasonic wafer cleaning is described. We found that LSI patterns on the side of a silicon wafer opposite to the incidence of ultrasound were damaged during single-wafer cleaning. Defects were observed when ultrasound penetrated through the wafer at a certain angle of incidence. A Schlieren system with pulsed illumination synchronized to the ultrasonic phase was constructed, and the wave fronts in water around the wafer during megasonic cleaning were imaged. We found that ultrasound passed through the wafer when Lamb waves were generated in the wafer. This was confirmed with a computer simulation of the wave propagation.

Original languageEnglish
Title of host publicationUltra Clean Processing of Silicon Surfaces 2000
EditorsMarc Heyns, Paul Mertens, Marc Meuris
PublisherTrans Tech Publications Ltd
Pages55-58
Number of pages4
ISBN (Print)9783908450573
DOIs
Publication statusPublished - 2001
Event5th International Symposium on Ultra Clean Processing of Silicon Surfaces, UCPSS 2000 - Ostend, Belgium
Duration: 2000 Sep 182000 Sep 20

Publication series

NameSolid State Phenomena
Volume76-77
ISSN (Print)1012-0394
ISSN (Electronic)1662-9779

Other

Other5th International Symposium on Ultra Clean Processing of Silicon Surfaces, UCPSS 2000
CountryBelgium
CityOstend
Period00/9/1800/9/20

Keywords

  • Lamb wave
  • Megasonics
  • Schlieren method

ASJC Scopus subject areas

  • Atomic and Molecular Physics, and Optics
  • Materials Science(all)
  • Condensed Matter Physics

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