Synchronous Schlieren image analysis of megasonic single wafer cleaning

Takashi Azuma; Akihiro Tomozawa; Hideo Kinoshita; Shin Ichiro Umemura

Synchronous Schlieren image analysis of megasonic single wafer cleaning

Takashi Azuma, Akihiro Tomozawa, Hideo Kinoshita, Shin Ichiro Umemura

MEN - Biomedical Engineering

Research output: Contribution to journal › Conference article › peer-review

Abstract

A synchronous Schlieren system for quantitative analysis of the ultrasonic field in megasonic wafer cleaning is described. We found that LSI patterns on the side of a silicon wafer opposite to the incidence of ultrasound were damaged during single-wafer cleaning. Defects were observed when ultrasound penetrated through the wafer at a certain angle of incidence. A Schlieren system with pulsed illumination synchronized to the ultrasonic phase was constructed, and the wave fronts in water around the wafer during megasonic cleaning were imaged. We found that ultrasound passed through the wafer when Lamb waves were generated in the wafer. This was confirmed with a computer simulation of the wave propagation.

Original language	English
Pages (from-to)	55-58
Number of pages	4
Journal	Diffusion and Defect Data Pt.B: Solid State Phenomena
Volume	76-77
Publication status	Published - 2000 Dec 1
Event	5th Internatinal Symposium on Ultra Clean Processing of Silicon Surfaces (UCPSS 2000) - Ostend, Belgium Duration: 2000 Sep 18 → 2000 Sep 20

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Materials Science(all)
Condensed Matter Physics
Physics and Astronomy (miscellaneous)

Fingerprint Dive into the research topics of 'Synchronous Schlieren image analysis of megasonic single wafer cleaning'. Together they form a unique fingerprint.

Cite this

@article{cb656af291134ac39befc4a582525ad4,

title = "Synchronous Schlieren image analysis of megasonic single wafer cleaning",

abstract = "A synchronous Schlieren system for quantitative analysis of the ultrasonic field in megasonic wafer cleaning is described. We found that LSI patterns on the side of a silicon wafer opposite to the incidence of ultrasound were damaged during single-wafer cleaning. Defects were observed when ultrasound penetrated through the wafer at a certain angle of incidence. A Schlieren system with pulsed illumination synchronized to the ultrasonic phase was constructed, and the wave fronts in water around the wafer during megasonic cleaning were imaged. We found that ultrasound passed through the wafer when Lamb waves were generated in the wafer. This was confirmed with a computer simulation of the wave propagation.",

author = "Takashi Azuma and Akihiro Tomozawa and Hideo Kinoshita and Umemura, {Shin Ichiro}",

year = "2000",

month = dec,

day = "1",

language = "English",

volume = "76-77",

pages = "55--58",

journal = "Solid State Phenomena",

issn = "1012-0394",

publisher = "Scientific.net",

note = "5th Internatinal Symposium on Ultra Clean Processing of Silicon Surfaces (UCPSS 2000) ; Conference date: 18-09-2000 Through 20-09-2000",

}

TY - JOUR

T1 - Synchronous Schlieren image analysis of megasonic single wafer cleaning

AU - Azuma, Takashi

AU - Tomozawa, Akihiro

AU - Kinoshita, Hideo

AU - Umemura, Shin Ichiro

PY - 2000/12/1

Y1 - 2000/12/1

N2 - A synchronous Schlieren system for quantitative analysis of the ultrasonic field in megasonic wafer cleaning is described. We found that LSI patterns on the side of a silicon wafer opposite to the incidence of ultrasound were damaged during single-wafer cleaning. Defects were observed when ultrasound penetrated through the wafer at a certain angle of incidence. A Schlieren system with pulsed illumination synchronized to the ultrasonic phase was constructed, and the wave fronts in water around the wafer during megasonic cleaning were imaged. We found that ultrasound passed through the wafer when Lamb waves were generated in the wafer. This was confirmed with a computer simulation of the wave propagation.

AB - A synchronous Schlieren system for quantitative analysis of the ultrasonic field in megasonic wafer cleaning is described. We found that LSI patterns on the side of a silicon wafer opposite to the incidence of ultrasound were damaged during single-wafer cleaning. Defects were observed when ultrasound penetrated through the wafer at a certain angle of incidence. A Schlieren system with pulsed illumination synchronized to the ultrasonic phase was constructed, and the wave fronts in water around the wafer during megasonic cleaning were imaged. We found that ultrasound passed through the wafer when Lamb waves were generated in the wafer. This was confirmed with a computer simulation of the wave propagation.

UR - http://www.scopus.com/inward/record.url?scp=18544401492&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=18544401492&partnerID=8YFLogxK

M3 - Conference article

AN - SCOPUS:18544401492

VL - 76-77

SP - 55

EP - 58

JO - Solid State Phenomena

JF - Solid State Phenomena

SN - 1012-0394

T2 - 5th Internatinal Symposium on Ultra Clean Processing of Silicon Surfaces (UCPSS 2000)

Y2 - 18 September 2000 through 20 September 2000

ER -