TY - GEN
T1 - Surface-tension driven self-assembly for VCSEL chip bonding to achieve 3D and hetero integration
AU - Ito, Y.
AU - Fukushima, T.
AU - Lee, K. W.
AU - Choki, K.
AU - Tanaka, T.
AU - Koyanagi, M.
PY - 2014
Y1 - 2014
N2 - Self-assembly with liquid surface tension was applied to tiny chips that were difficult to manipulate. Dummy chips that mimics VCSEL were aligned toward hydrophilic sites surrounding a hydrophobic area on an Si interposer. The alignment accuracies were 0 and-2.0 μm in X and Y directions.
AB - Self-assembly with liquid surface tension was applied to tiny chips that were difficult to manipulate. Dummy chips that mimics VCSEL were aligned toward hydrophilic sites surrounding a hydrophobic area on an Si interposer. The alignment accuracies were 0 and-2.0 μm in X and Y directions.
UR - http://www.scopus.com/inward/record.url?scp=84906969240&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84906969240&partnerID=8YFLogxK
U2 - 10.1109/LTB-3D.2014.6886154
DO - 10.1109/LTB-3D.2014.6886154
M3 - Conference contribution
AN - SCOPUS:84906969240
SN - 9781479952618
T3 - Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014
SP - 15
BT - Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014
PB - IEEE Computer Society
T2 - 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014
Y2 - 15 July 2014 through 16 July 2014
ER -