Surface-tension driven self-assembly for VCSEL chip bonding to achieve 3D and hetero integration

Y. Ito, Takafumi Fukushima, Kanuku Ri, K. Choki, Tetsu Tanaka, Mitsumasa Koyanagi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Self-assembly with liquid surface tension was applied to tiny chips that were difficult to manipulate. Dummy chips that mimics VCSEL were aligned toward hydrophilic sites surrounding a hydrophobic area on an Si interposer. The alignment accuracies were 0 and-2.0 μm in X and Y directions.

Original languageEnglish
Title of host publicationProceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014
PublisherIEEE Computer Society
Number of pages1
ISBN (Print)9781479952618
DOIs
Publication statusPublished - 2014 Jan 1
Event2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014 - Tokyo, Japan
Duration: 2014 Jul 152014 Jul 16

Publication series

NameProceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014

Other

Other2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014
CountryJapan
CityTokyo
Period14/7/1514/7/16

ASJC Scopus subject areas

  • Filtration and Separation

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  • Cite this

    Ito, Y., Fukushima, T., Ri, K., Choki, K., Tanaka, T., & Koyanagi, M. (2014). Surface-tension driven self-assembly for VCSEL chip bonding to achieve 3D and hetero integration. In Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014 [6886154] (Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014). IEEE Computer Society. https://doi.org/10.1109/LTB-3D.2014.6886154