Abstract
Self-assembly with liquid surface tension was applied to tiny chips that were difficult to manipulate. Dummy chips that mimics VCSEL were aligned toward hydrophilic sites surrounding a hydrophobic area on an Si interposer. The alignment accuracies were 0 and-2.0 μm in X and Y directions.
| Original language | English |
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| Title of host publication | Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014 |
| Publisher | IEEE Computer Society |
| Number of pages | 1 |
| ISBN (Print) | 9781479952618 |
| DOIs | |
| Publication status | Published - 2014 Jan 1 |
| Event | 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014 - Tokyo, Japan Duration: 2014 Jul 15 → 2014 Jul 16 |
Publication series
| Name | Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014 |
|---|
Other
| Other | 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014 |
|---|---|
| Country | Japan |
| City | Tokyo |
| Period | 14/7/15 → 14/7/16 |
ASJC Scopus subject areas
- Filtration and Separation
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Cite this
Ito, Y., Fukushima, T., Ri, K., Choki, K., Tanaka, T., & Koyanagi, M. (2014). Surface-tension driven self-assembly for VCSEL chip bonding to achieve 3D and hetero integration. In Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014 [6886154] (Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014). IEEE Computer Society. https://doi.org/10.1109/LTB-3D.2014.6886154