Surface tension and density measurements of Sn-Ag-Sb liquid alloys and phase diagram calculations of the Sn-Ag-Sb ternary system

Zbigniew Moser, Wladysław Ga̧sior, Janusz Pstruś, Satoru Ishihara, Xing Jun Liu, Ikuo Ohnuma, Ryosuke Kainuma, Kiyohito Ishida

Research output: Contribution to journalArticle

36 Citations (Scopus)

Abstract

The maximum bubble pressure method has been used to measure the surface tension of pure antimony and the surface tension and density (dilatometric method) of Sn-3.8 at%Ag eutectic base alloys with 0.03,0.06 and 0.09 molar fraction of antimony at a temperature range from 550 to 1200 K. The linear dependencies of surface tension and density on temperature were observed and they were described by straight-line equations. Moreover, experimental determination of phase diagram and thermodynamic calculations in the Sn-Ag-Sb system were performed and the resulting optimized thermodynamic parameters were used for modeling of the surface tension. In addition, a non-equilibrium solidification process using the Scheil model was simulated and compared with the equilibrium solidification behavior of a Sn-Ag-Sb alloy.

Original languageEnglish
Pages (from-to)652-660
Number of pages9
JournalMaterials Transactions
Volume45
Issue number3
DOIs
Publication statusPublished - 2004 Mar

Keywords

  • Calphad
  • Lead-free solder
  • Microsoldering
  • Thermodynamics

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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