Surface micromachined thermally driven micropump

Won Ick Jang, Chang Auck Choi, Chi Hoon Jun, Youn Tae Kim, Masayoshi Esashi

Research output: Contribution to journalArticlepeer-review

16 Citations (Scopus)

Abstract

This paper presents the design, fabrication, and testing of a thermally driven micropump fabricated by surface micromachining. The micropump consists of a membrane of a corrugated diaphragm, a sealed cavity filled with air and buried with n+ polysilicon microheater and a microchannel with a pair of nozzle and diffuser valves. The polysilicon membrane was used as a structural layer and low-temperature oxide (LTO) and plasma enhanced chemical vapor deposition (PECVD) oxide as a sacrificial layer. Using gas-phase etching (GPE) process with anhydrous hydrogen fluoride (HF) gas and isopropyl alcohol (IPA) vapor, we successfully fabricated the thermally driven micropmump with no virtually process-induced stiction. The flow rate of the micropump is measured at the applied voltage of 25V with the duty cycle of 50%. The maximum flow rate of the micropump with the corrugated diaphragm is about 3.1μl/min at 5Hz.

Original languageEnglish
Pages (from-to)151-158
Number of pages8
JournalSensors and Actuators, A: Physical
Volume115
Issue number1
DOIs
Publication statusPublished - 2004 Sep 15

Keywords

  • Diaphragm
  • Dry release
  • Microheater
  • Micromachining
  • Micropump
  • Stiction

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Instrumentation
  • Condensed Matter Physics
  • Surfaces, Coatings and Films
  • Metals and Alloys
  • Electrical and Electronic Engineering

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