Suppression of surface micro-roughness of silicon wafer by addition of alcohol into ultra pure water for rinsing peocess

M. Yamamoto, K. Nii, H. Morinaga, Akinobu Teramoto, T. Ohmi

Research output: Contribution to journalConference article

2 Citations (Scopus)

Abstract

The suppression of surface micro-roughness by improved rinsing process was studied. The progress for cleaning method to prepare the flat silicon wafer surface on atomic order is intensely needed for higher carrier mobility. Silicon surface is exposed to several chemical substances through cleaning processes. Ultrapure water also dissolves silicon atoms and roughens the silicon surface. Several kinds of alcohols and ketone, especially isopropyl alcohol (IPA), were used as additives for ultrapure water to investigate the effect on suppression of surface roughening by water. The additives suppress roughening of the silicon surface by preventing silicon dissolving into the solution. The structure and concentration of additive and the mechanism of the suppression of surface micro-roughness was investigated.

Original languageEnglish
Pages (from-to)51-58
Number of pages8
JournalECS Transactions
Volume1
Issue number3
Publication statusPublished - 2005 Dec 1
Event9th International Symposium on Cleaning Technology in Semiconductor Device Manufacturing - 2005 Fall Meeting of the Electrochemical Society - Los Angeles, CA, United States
Duration: 2005 Oct 162005 Oct 21

ASJC Scopus subject areas

  • Engineering(all)

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