Suppression of surface micro-roughness of silicon wafer by addition of alcohol into ultra pure water for rinsing peocess

M. Yamamoto, K. Nii, H. Morinaga, A. Teramoto, T. Ohmi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The suppression of surface micro-roughness by improved rinsing process was studied. The progress for cleaning method to prepare the flat silicon wafer surface on atomic order is intensely needed for higher carrier mobility. Silicon surface is exposed to several chemical substances through cleaning processes. Ultrapure water also dissolves silicon atoms and roughens the silicon surface. Several kinds of alcohols and ketone, especially isopropyl alcohol (IPA), were used as additives for ultrapure water to investigate the effect on suppression of surface roughening by water. The additives suppress roughening of the silicon surface by preventing silicon dissolving into the solution. The structure and concentration of additive and the mechanism of the suppression of surface micro-roughness was investigated.

Original languageEnglish
Title of host publicationCleaning Technology in Semiconductor Device Manufacturing IX
PublisherElectrochemical Society Inc.
Pages51-58
Number of pages8
Edition3
ISBN (Electronic)9781607685395
Publication statusPublished - 2006
Externally publishedYes
Event9th International Symposium on Cleaning Technology in Semiconductor Device Manufacturing - 2005 Fall Meeting of the Electrochemical Society - Los Angeles, CA, United States
Duration: 2005 Oct 162005 Oct 21

Publication series

NameECS Transactions
Number3
Volume1
ISSN (Print)1938-5862
ISSN (Electronic)1938-6737

Other

Other9th International Symposium on Cleaning Technology in Semiconductor Device Manufacturing - 2005 Fall Meeting of the Electrochemical Society
Country/TerritoryUnited States
CityLos Angeles, CA
Period05/10/1605/10/21

ASJC Scopus subject areas

  • Engineering(all)

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