Applications of SiH-free silicon nitride (SiN) films, formed by tetrachlorosilane (TCS) and ammonia, have been proved to effectively suppress the SiN-induced boron penetration. The SiN-induced boron penetration has been investigated in detail by using boron-doped polysilicon gated capacitors with several kinds of thick SiN films. It was clarified for the first time that the SiN-induced boron penetration becomes worse with SiH content in SiN films and deposition technique of SiH-free TCS-SiN films is essential for realization of the high-performance PMOSFETs.
- Boron penetration
- Silicon nitride
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering