Suppression of ambient-temperature creep in CP-Ti by cold-rolling

Tatsuya Kameyama, Tetsuya Matsunaga, Eiichi Sato, Kazuhiko Kuribayashi

Research output: Contribution to journalArticlepeer-review

25 Citations (Scopus)


The suppressing effect of ambient-temperature creep of CP-Ti by cold-rolling was reported. Annealed plates of CP-Ti grade 2 were cold-rolled with thickness reductions, and then creep tests under the applied stresses of 0.6-0.9σ0.2 were performed at ambient temperature. With increasing the thickness reduction, the twin, dislocation density and σ0.2 were found to increase. At the same time, the steady-state creep rates under the applied stress for constant σ/σ0.2 were decreased. The cold-rolled sample with 20% thickness reduction was then annealed at 813 K for 2400 s to decrease only the dislocation density. After the annealing, the steady-state creep rate remained constant, suggesting that the reduction of the steady-state creep is associated with the increasing twin density.

Original languageEnglish
Pages (from-to)364-367
Number of pages4
JournalMaterials Science and Engineering A
Issue numberC
Publication statusPublished - 2009 Jun 15


  • Ambient-temperature creep
  • CP-Ti
  • Cold-rolling
  • Dislocation
  • Suppression
  • Twin

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering


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