TY - GEN
T1 - Suppressing Vt and Gm variability of FinFETs using amorphous metal gates for 14 nm and beyond
AU - Matsukawa, Takashi
AU - Liu, Yongxun
AU - Mizubayashi, Wataru
AU - Tsukada, Junichi
AU - Yamauchi, Hiromi
AU - Endo, Kazuhiko
AU - Ishikawa, Yuki
AU - O'Uchi, Shin Ichi
AU - Ota, Hiroyuki
AU - Migita, Shinji
AU - Morita, Yukinori
AU - Masahara, Meishoku
PY - 2012/12/1
Y1 - 2012/12/1
N2 - Amorphous TaSiN metal gates (MGs) are successfully introduced in FinFETs to suppress work function variation (WFV) of the MG, which is a dominant contributor to threshold voltage (Vt) variability of the undoped channel MG FinFETs. Comparing with a poly-crystalline TiN gate, the TaSiN gate reduces Vt variation drastically and records the smallest A Vt value of 1.34 mVμm reported so far for MG FinFETs. Interface traps also become a dominant AVt origin in the case of well-suppressed WFV using the amorphous M G. The WFV suppression is also effective to reduce trans-conductance (Gm) variability which will be a dominant source of on-current (Ion) variability in 14 nm technology and beyond.
AB - Amorphous TaSiN metal gates (MGs) are successfully introduced in FinFETs to suppress work function variation (WFV) of the MG, which is a dominant contributor to threshold voltage (Vt) variability of the undoped channel MG FinFETs. Comparing with a poly-crystalline TiN gate, the TaSiN gate reduces Vt variation drastically and records the smallest A Vt value of 1.34 mVμm reported so far for MG FinFETs. Interface traps also become a dominant AVt origin in the case of well-suppressed WFV using the amorphous M G. The WFV suppression is also effective to reduce trans-conductance (Gm) variability which will be a dominant source of on-current (Ion) variability in 14 nm technology and beyond.
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U2 - 10.1109/IEDM.2012.6479002
DO - 10.1109/IEDM.2012.6479002
M3 - Conference contribution
AN - SCOPUS:84876109905
SN - 9781467348706
T3 - Technical Digest - International Electron Devices Meeting, IEDM
BT - 2012 IEEE International Electron Devices Meeting, IEDM 2012
T2 - 2012 IEEE International Electron Devices Meeting, IEDM 2012
Y2 - 10 December 2012 through 13 December 2012
ER -