Superthermostability of nanoscale TIC-reinforced copper alloys manufactured by a two-step ball-milling process

Fenglin Wang, Yunping Li, Xiandong Xu, Yuichiro Koizumi, Kenta Yamanaka, Huakang Bian, Akihiko Chiba

Research output: Contribution to journalArticlepeer-review

14 Citations (Scopus)

Abstract

A Cu-TiC alloy, with nanoscale TiC particles highly dispersed in the submicron-grained Cu matrix, was manufactured by a self-developed two-step ball-milling process on Cu, Ti and C powders. The thermostability of the composite was evaluated by high-temperature isothermal annealing treatments, with temperatures ranging from 727 to 1273 K. The semicoherent nanoscale TiC particles with Cu matrix, mainly located along the grain boundaries, were found to exhibit the promising trait of blocking grain boundary migrations, which leads to a super-stabilized microstructures up to approximately the melting point of copper (1223 K). Furthermore, the Cu-TiC alloys after annealing at 1323 K showed a slight decrease in Vickers hardness as well as the duplex microstructure due to selective grain growth, which were discussed in terms of hardness contributions from various mechanisms.

Original languageEnglish
Pages (from-to)4035-4053
Number of pages19
JournalPhilosophical Magazine
Volume95
Issue number35
DOIs
Publication statusPublished - 2015 Dec 12

Keywords

  • Ultrafine-grained (UFG) microstructure
  • ball-milling process
  • particle pinning
  • thermal stability

ASJC Scopus subject areas

  • Condensed Matter Physics

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