Super chip integration technology for three-dimensionally stacked retinal prosthesis chips

Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

We have developed 3-D integration technology based on a wafer-to-wafer bonding method, fabricated several kinds of 3-D prototype chips, and confirmed their basic operation. To overcome a throughput problem in the conventional die-to-wafer 3-D integration, we newly proposed self-assembled die-to-wafer 3-D integration technology called Super Chip Integration, where a new chip self-assembly technique using liquid surface tension is introduced. A large number of chips can be quickly and precisely self-assembled onto Si substrate with an alignment accuracy of ∼0.4 μm. These chips can be also self-assembled onto polymeric substrates.

Original languageEnglish
Title of host publicationSmart Systems Integration 2009, SSI 2009
PublisherAKA Verlag
Pages299-306
Number of pages8
ISBN (Electronic)9783898386166
Publication statusPublished - 2009
EventSmart Systems Integration Conference 2009, SSI 2009 - Brussels, Belgium
Duration: 2009 Mar 102009 Mar 11

Publication series

NameSmart Systems Integration 2009, SSI 2009

Conference

ConferenceSmart Systems Integration Conference 2009, SSI 2009
CountryBelgium
CityBrussels
Period09/3/1009/3/11

ASJC Scopus subject areas

  • Artificial Intelligence
  • Computer Science Applications
  • Computer Networks and Communications

Fingerprint Dive into the research topics of 'Super chip integration technology for three-dimensionally stacked retinal prosthesis chips'. Together they form a unique fingerprint.

Cite this