Submicron-scale depth profiling of residual stress in amorphous materials by incremental focused ion beam slotting

B. Winiarski, A. Gholinia, J. Tian, Y. Yokoyama, P. K. Liaw, P. J. Withers

Research output: Contribution to journalArticlepeer-review

22 Citations (Scopus)

Abstract

This paper reports a new technique, namely the incremental micro-slotting cutting method, for the investigation of residual stress profiles as a function of depth on a micron scale. The residual-stresses in a peened bulk-metallic glass (BMG) (Zr 50Cu 40Al 10, in atomic per cent) are estimated using finite-element analysis of the surface relaxations, as measured by digital image correlation analysis from field-emission gun scanning electron microscopy images, which occur when a micro-slot is stepwise micro-machined by focused ion beam. The calculation algorithm, which solves this inverse problem of residual-stress estimation, is based on the unit pulses method and is stabilized by a Tikhonov regularization scheme. It is demonstrated on a peened BMG that the new technique allows residual-stress profiles in amorphous materials to be inferred with high spatial definition (∼400 nm). Observations point to the scalability of this method to study residual-stress profiles in volumes as small as 1 × 1 × 0.2 μm 3 or less, and is particularly well suited to glasses, but can also be applied to crystalline materials.

Original languageEnglish
Pages (from-to)2337-2349
Number of pages13
JournalActa Materialia
Volume60
Issue number5
DOIs
Publication statusPublished - 2012 Mar

Keywords

  • Bulk metallic glass
  • Focused ion beam
  • Residual stress
  • Scanning electron microscopy
  • Two-dimensional image correlation

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Ceramics and Composites
  • Polymers and Plastics
  • Metals and Alloys

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