A formulation of elastoplastic stress analysis of the laminated structure is shown on the basis or the finite element method with use of Voigt's and Reuss's assumptions. Systematic tests were carried out at room and cryogenic temperatures with specimens composed of stainless steel and epoxy resin to depict a slip curve representing strength of the interface. A three point bending test was performed to measure temperature rise due to slip and to evaluate temperature distribution by a 3-D computer code. Quench experiments were also carried out simulating bulk heating with 35 MeV electron beam.
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering