Study on microstructure and properties of SiC/Cu composites fabricated by spark plasma sintering

Lin Zhang, Xuanhui Qu, Baihua Duan, Xinbo He, Xin Lu, Mingli Qin

Research output: Contribution to journalArticlepeer-review

3 Citations (Scopus)

Abstract

SiC/Cu composites were prepared with Cu-coated SiC produced by electroless plating and Ni-coated SiC powder prepared by hydrogen reduction under high pressure as raw materials by using spark plasma sintering (SPS) technology. The effects of content of reinforcing phase and sintering temperature on den-sification behavior were considered. And the interface connect of the composites with coated and uncoated powders were studied. Then their microstructure, the thermal expansion behavior and mechanical properties were investigated also. From these results, it could be concluded that using coated powders densification and bonding strength of interface of the composites were improved and enhanced. The relative density was 96.7% and compressive strength reached 1012 MPa. Thermal expansion coefficient of SiC/Cu composites ranged between 7.5-11.4 × 10-6·K-1 and decreased with increasing SiC content. Thermal hysteresis phenomenon emerged during the thermal cycling and was influenced under the content of reinforcing phase and interface bonding strength.

Original languageEnglish
Pages (from-to)614-619
Number of pages6
JournalXiyou Jinshu / Chinese Journal of Rare Metals
Volume32
Issue number5
Publication statusPublished - 2008 Oct 1
Externally publishedYes

Keywords

  • Coefficient of thermal expansion
  • SiC/Cu composite
  • Spark plasma sintering
  • Thermal cycling curve

ASJC Scopus subject areas

  • Metals and Alloys

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