Study on mechanical properties for epoxy resin by molecular dynamics

M. Onodera, Tomonaga Okabe, M. Hasimoto, K. Yoshioka

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

We investigated curing characteristics and mechanical properties of Epoxy systems by experimentation and numerical simulation. We proposed a new curing simulation based on MD simulations considering detailed reactivity mechanisms, and we also investigated mechanical properties of epoxy resin using MD simulations. In order to validate the simulation results, we utilized differential scanning calorimetry (DSC) measurements for evaluating the curing process experimentally and conducted the compression and tensile tests to assess mechanical properties.

Original languageEnglish
Title of host publication28th Annual Technical Conference of the American Society for Composites 2013, ASC 2013
Pages220-231
Number of pages12
Publication statusPublished - 2013 Dec 1
Event28th Annual Technical Conference of the American Society for Composites 2013, ASC 2013 - State College, PA, United States
Duration: 2013 Sep 92013 Sep 11

Publication series

Name28th Annual Technical Conference of the American Society for Composites 2013, ASC 2013
Volume1

Other

Other28th Annual Technical Conference of the American Society for Composites 2013, ASC 2013
CountryUnited States
CityState College, PA
Period13/9/913/9/11

ASJC Scopus subject areas

  • Ceramics and Composites

Fingerprint Dive into the research topics of 'Study on mechanical properties for epoxy resin by molecular dynamics'. Together they form a unique fingerprint.

Cite this