Study on curing reaction characteristic of epoxy resin

T. Takehara, T. Okabe, N. Hirano, K. Inose

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In this study, we investigated the curing reaction of epoxy resin by experiment and numerical simulation. The experiment approach used differential scanning calorimetry (DSC) to obtain curing curves of epoxy resin by mixing curing agents and base resins. The computational approach used the molecular orbital method (MO) and the molecular dynamics method (MD) to consider activation energy, heat of formation, and polarization in the curing reaction. Focusing on three types of base resin and three types of curing agent, we clarified that the curing agent is the main factor that controls curing characteristics.

Original languageEnglish
Title of host publication27th Annual Technical Conference of the American Society for Composites 2012, Held Jointly with 15th Joint US-Japan Conference on Composite Materials and ASTM-D30 Meeting
Pages140-156
Number of pages17
Publication statusPublished - 2012 Dec 1
Event27th Annual Technical Conference of the American Society for Composites 2012, Held Jointly with 15th Joint US-Japan Conference on Composite Materials and ASTM-D30 Meeting - Arlington, TX, United States
Duration: 2012 Oct 12012 Oct 3

Publication series

Name27th Annual Technical Conference of the American Society for Composites 2012, Held Jointly with 15th Joint US-Japan Conference on Composite Materials and ASTM-D30 Meeting

Other

Other27th Annual Technical Conference of the American Society for Composites 2012, Held Jointly with 15th Joint US-Japan Conference on Composite Materials and ASTM-D30 Meeting
CountryUnited States
CityArlington, TX
Period12/10/112/10/3

ASJC Scopus subject areas

  • Ceramics and Composites
  • Materials Chemistry

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    Takehara, T., Okabe, T., Hirano, N., & Inose, K. (2012). Study on curing reaction characteristic of epoxy resin. In 27th Annual Technical Conference of the American Society for Composites 2012, Held Jointly with 15th Joint US-Japan Conference on Composite Materials and ASTM-D30 Meeting (pp. 140-156). (27th Annual Technical Conference of the American Society for Composites 2012, Held Jointly with 15th Joint US-Japan Conference on Composite Materials and ASTM-D30 Meeting).