TY - GEN
T1 - Study of high isolation and miniature saw duplexer
AU - Shiba, Takashi
AU - Ooki, Masashi
AU - Hamasaki, Junichi
AU - Hikino, Osamu
AU - Fujita, Yuji
PY - 2006/12/1
Y1 - 2006/12/1
N2 - Finite element methods for integrated circuits of LTCC and equivalent circuit models for SAW chips are applied to SAW duplexer analysis. We improve this composite method with considering feed through. A good agreement with this improved composite simulation and experiment is obtained. We have found that magnetic interaction between a phase-shifter and a matching element for Tx circuit becomes a worse of Tx-Rx isolation. We have also found an improved shape of element to suppress the magnetic interaction between these circuits by try and error method. An isolation value of 48 dB in Rx band is observed at an improved duplexer. Consequently it is verified that a improved composite model is effective for analyzing Tx-Rx isolation of a miniature SAW duplexer. And high isolation characteristic for SAW duplexer is also obtained by using improved structure.
AB - Finite element methods for integrated circuits of LTCC and equivalent circuit models for SAW chips are applied to SAW duplexer analysis. We improve this composite method with considering feed through. A good agreement with this improved composite simulation and experiment is obtained. We have found that magnetic interaction between a phase-shifter and a matching element for Tx circuit becomes a worse of Tx-Rx isolation. We have also found an improved shape of element to suppress the magnetic interaction between these circuits by try and error method. An isolation value of 48 dB in Rx band is observed at an improved duplexer. Consequently it is verified that a improved composite model is effective for analyzing Tx-Rx isolation of a miniature SAW duplexer. And high isolation characteristic for SAW duplexer is also obtained by using improved structure.
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U2 - 10.1109/ULTSYM.2006.206
DO - 10.1109/ULTSYM.2006.206
M3 - Conference contribution
AN - SCOPUS:78649385893
SN - 1424402018
SN - 9781424402014
T3 - Proceedings - IEEE Ultrasonics Symposium
SP - 1060
EP - 1064
BT - 2006 IEEE International Ultrasonics Symposium, IUS
ER -