Study for the Evaluation of Fracture Properties on Silicon Carbide Under High Temperature by Means of an Acoustic Emission Technique

Masahiro Saito, Hideaki Takahashi, Toshiyuki Hashida, Makoto Sasaki, Toshio Hirai

Research output: Contribution to journalArticle

Abstract

Modified Small Punch(MSP) Test using Acoustic Emission(AE) technique was examined on silicon carbide(SiC), preparing by sintering or chemical vapor deposition(CVD), from room temperature to very high temperatures. MSP testing method based on miniaturized test technique was developed to evaluate the each fracture property from once a test, and is effective especially for the material evaluation at the initial developed stage on new materials such as Functionally Gradient Materials(FGMs). From these results, the change of mechanical properties with the difference of crystal structure and fabrication method on ceramics was examined. Furthermore, micro fracture process for ceramics at high tenperature environment was evaluated by AE data and the cause for the strength degradation of ceramics at very high temperatures was also discussed. The proposed simultaneous use of MSP test and AE method could provide a great deal of the useful information on the microscopic fracture mechanism in silicon carbide ceramics at very high terrperatures.

Original languageEnglish
Pages (from-to)951-956
Number of pages6
Journaljournal of the japan society of powder and powder metallurgy
Volume37
Issue number7
DOIs
Publication statusPublished - 1990 Jan 1
Externally publishedYes

ASJC Scopus subject areas

  • Mechanical Engineering
  • Industrial and Manufacturing Engineering
  • Metals and Alloys
  • Materials Chemistry

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