Structural reliability design of plastic packages using Cu-alloy lead-frames

Research output: Chapter in Book/Report/Conference proceedingConference contribution

13 Citations (Scopus)

Abstract

The residual stress in silicon chips encapsulated in plastic packages using Cu-alloy frames was measured using stress sensing chips by varying the combination of structure and material of metallic lead-frames and molding resin because the mechanical reliability such as cracking of silicon chips and the shift of the electronic performance of LSI strongly depends on the stress. Since the adhesion condition between a silicon chip and the Cu-alloy frame was unstable due to the large mismatch in thermal expansion coefficient between them, the residual stress after encapsulation varied from tensile stress to high compressive stress depending on the combination of the packaging materials such as die-bonding paste and molding resin. It was found that the residual stress can be controlled and minimized by using the chip-on-lead (COL) type package because the dielectric film between the Cu-alloy frame and a silicon chip acts as a stress relaxation layer.

Original languageEnglish
Title of host publicationProceedings of 5th Electronics Packaging Technology Conference, EPTC 2003
EditorsMahadevan K. Iyer, Yew Cheong Mui, Kok Chuan Toh
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages785-790
Number of pages6
ISBN (Electronic)0780382056, 9780780382053
DOIs
Publication statusPublished - 2003 Jan 1
Event5th Electronics Packaging Technology Conference, EPTC 2003 - Singapore, Singapore
Duration: 2003 Dec 102003 Dec 12

Publication series

NameProceedings of 5th Electronics Packaging Technology Conference, EPTC 2003

Other

Other5th Electronics Packaging Technology Conference, EPTC 2003
Country/TerritorySingapore
CitySingapore
Period03/12/1003/12/12

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Industrial and Manufacturing Engineering
  • Electronic, Optical and Magnetic Materials

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