Structural design system for thermally enhanced LSI packages

Nae Yoneda, Makoto Kitano, Hideo Miura

Research output: Contribution to journalConference articlepeer-review

Abstract

A program practical that enables design engineers to simply design thermal resistance of IC packages has been developed. Template solid models of IC packages and an automatic system for determining heat transfer coefficient are included in the program. The program does not require the design engineers to have a special knowledge of thermal analysis, and it runs on a personal computer with a 200-MHz PowerPC 604 using 13 MB of RAM. It takes only about 10 seconds to calculate thermal resistance of a quad flat package (QFP) mounted on a printed circuit board (PCB). The error between the calculated and measured values was confirmed to be within about +/-20% by 144-case investigations. A thermally enhanced QFP with a heat spreader (JEDEC code: MO-204) has been developed using this program.

Original languageEnglish
Pages (from-to)1088-1095
Number of pages8
JournalProceedings - Electronic Components and Technology Conference
Publication statusPublished - 1999 Jan 1
Externally publishedYes
EventProceedings of the 1999 49th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA
Duration: 1999 Jun 11999 Jun 4

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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