Strong adhesion of silver/polypyrrole composite onto plastic substrates toward flexible electronics

Flexible electronics require sufficient adhesion to substrates, such as a plastic or a polymer, of the electric wiring for devices. A composite of a conducting metal and a polymer is a candidate alternative to pure metals in terms of wire flexibility. The purpose of this study was to evaluate the adhesiveness of a silver/polypyrrole composite to plastic substrates and to clarify the mechanism of adhesion. The composite was prepared on various plastic substrates by dropping its fluid dispersion. Its adhesiveness was evaluated by the peel-off test and its interfacial structure was characterized by microscopy measurements. Some polymers including Teflon with generally weak adhesion to different materials showed a high adhesiveness of more than 90%. The strong adhesion was related to the anchoring effect of the composite penetrating into the pores near the surface of the substrate.