Stress-induced migration of electroplated copper thin film interconnections depending on thermal history

Ken Suzuki, Hideo Miura, Osamu Asai, Naoki Saito, Naokazu Murata

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Effect of the change of crystallinity and micro texture of electroplated copper thin films by annealing on the stressinduced migration was investigated experimentally and theoretically. The micro texture of electroplated copper thin films changed drastically as a function of their electroplating conditions and the annealing temperature after the electroplating. The crystallinity of the electroplated film was improved by annealing at 400oC for 3 hours. However, stress-induced migration was activated even though interconnection was kept at room temperature without any application of electrical current after annealing. This is because high residual stress was caused by shrinkage of electroplated copper due to change of crystallinity. Molecular dynamics simulations showed that copper atoms diffused significantly around the grain boundaries in the annealed film in which high residual tensile stress existed.

Original languageEnglish
Title of host publicationInternational Conference on Simulation of Semiconductor Processes and Devices, SISPAD 2012 Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages396-399
Number of pages4
ISBN (Electronic)9780615717562
Publication statusPublished - 2012
Event2012 International Conference on Simulation of Semiconductor Processes and Devices, SISPAD 2012 - Denver, United States
Duration: 2012 Sep 52012 Sep 7

Publication series

NameInternational Conference on Simulation of Semiconductor Processes and Devices, SISPAD

Conference

Conference2012 International Conference on Simulation of Semiconductor Processes and Devices, SISPAD 2012
Country/TerritoryUnited States
CityDenver
Period12/9/512/9/7

Keywords

  • Electroplated copper thin film interconnection
  • Reliability
  • Stress-induced migration

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Computer Science Applications
  • Modelling and Simulation

Fingerprint

Dive into the research topics of 'Stress-induced migration of electroplated copper thin film interconnections depending on thermal history'. Together they form a unique fingerprint.

Cite this