Stochastic strain sensor using pull-in probability under white-noise-applied bistable state with reliable pull-in release mechanism

Y. Hatakeyama, Masayoshi Esashi, Shuji Tanaka

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

This paper describes a MEMS based stochastic sensor, which will be used in low S/N environments like high temperature plants. The mass which vibrates between two counter electrodes by white noise voltage is "pulled-in" to either of the counter electrodes by applying pulse voltage to the mass. The direction of the pull-in is determined stochastically, and the probability that the mass is pulled in to a particular side depends on mechanical strain applied to the sensor. Therefore, strain can be measured just by counting the number of pull-in to a particular side, which is easy even in low S/N environments. We demonstrated this sensing principle using an SOI-based sensor, which had a reliable pull-in release mechanism using a non-linear spring structure. We also demonstrated that the pull-in probability could be tuned by bias voltage applied to the counter electrodes, as predicted by simulation.

Original languageEnglish
Title of host publication2011 IEEE 24th International Conference on Micro Electro Mechanical Systems, MEMS 2011
Pages640-643
Number of pages4
DOIs
Publication statusPublished - 2011 Apr 13
Event24th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2011 - Cancun, Mexico
Duration: 2011 Jan 232011 Jan 27

Other

Other24th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2011
CountryMexico
CityCancun
Period11/1/2311/1/27

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Mechanical Engineering
  • Condensed Matter Physics
  • Electronic, Optical and Magnetic Materials

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  • Cite this

    Hatakeyama, Y., Esashi, M., & Tanaka, S. (2011). Stochastic strain sensor using pull-in probability under white-noise-applied bistable state with reliable pull-in release mechanism. In 2011 IEEE 24th International Conference on Micro Electro Mechanical Systems, MEMS 2011 (pp. 640-643). [5734506] https://doi.org/10.1109/MEMSYS.2011.5734506