Stochastic simulation of tape grinding for wafer-like workpiece

Keita Shimada, Ayaka Watanabe, Yoshifumi Takasu, Masayoshi Mizutani, Tsunemoto Kuriyagawa

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Advanced semiconductor materials including silicon carbide and gallium nitride possess excellent properties like high hardness, and high heat and chemical resistance compared to silicon. Such properties reversely prevent efficient production of wafers, therefore a new wafer finishing method, tape grinding, is developed to improve productivity. This paper proposes a simulation method of tape grinding, which method is developed by modifying the stochastic approach developed for plunge grinding. The distribution of abrasive grains on the grinding tape is represented by number density, and the material existence probability that is represented by Abbott-Firestone curve is modified by considering machining parameters. Tape grinding process were then conducted to confirm the calculation method.

Original languageEnglish
Title of host publicationAdvances in Abrasive Technology XIX
EditorsPeter Krajnik, Peter Krajnik, Amir Rashid, Hideki Aoyama, Xipeng Xu, Jun Wang
PublisherTrans Tech Publications Ltd
Pages91-96
Number of pages6
ISBN (Print)9783035710342
DOIs
Publication statusPublished - 2016 Jan 1
Event19th International Symposium on Advances in Abrasive Technology, ISAAT 2016 - Stockholm, Sweden
Duration: 2016 Oct 22016 Oct 5

Publication series

NameMaterials Science Forum
Volume874
ISSN (Print)0255-5476
ISSN (Electronic)1662-9752

Other

Other19th International Symposium on Advances in Abrasive Technology, ISAAT 2016
CountrySweden
CityStockholm
Period16/10/216/10/5

Keywords

  • Stochastic simulation
  • Tape grinding
  • Wafer process

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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  • Cite this

    Shimada, K., Watanabe, A., Takasu, Y., Mizutani, M., & Kuriyagawa, T. (2016). Stochastic simulation of tape grinding for wafer-like workpiece. In P. Krajnik, P. Krajnik, A. Rashid, H. Aoyama, X. Xu, & J. Wang (Eds.), Advances in Abrasive Technology XIX (pp. 91-96). (Materials Science Forum; Vol. 874). Trans Tech Publications Ltd. https://doi.org/10.4028/www.scientific.net/MSF.874.91