Abstract
Recently, fixed abrasive technologies have been needed to solve some problems with free abrasive technologies, such as processing efficiency and environmental pollution. Plane honing is one effective fixed abrasive technology for processing wafer-like materials. Advantages of plane honing include a high processing rate, slurry waste-free process, and high finishing accuracy. The paper presents a method to simulate the plane honing process based on statistical analysis of a grinding process. One of the most significant differences between grinding and plane honing is process controlling method: the former is positioncontrolled, whereas the latter is pressure-controlled processes. In order to treat a pressure-controlled process, the amount of material removed from each segment was assumed to be constant based on Preston's law, which is the most common principle for material removal in the polishing process. Reference curves of a segment were introduced to map tip points of abrasive grains contained in the segment. The reference curve can be compared with the surface curve of the workpiece to determine the material to be removed; repeating the comparison allows the plane honing process to be simulated. Plane honing experiments were conducted, and the results agreed qualitatively with the simulation results.
| Original language | English |
|---|---|
| Pages (from-to) | 576-583 |
| Number of pages | 8 |
| Journal | International Journal of Automation Technology |
| Volume | 8 |
| Issue number | 4 |
| Publication status | Published - 2014 Jul |
Keywords
- Fixed abrasive technology
- Plane honing
- Statistical approach
- Surface roughness
ASJC Scopus subject areas
- Mechanical Engineering
- Industrial and Manufacturing Engineering
