TY - JOUR
T1 - Stable growth and kinetic roughening in electrochemical deposition
AU - Iwamoto, Atsushi
AU - Yoshinobu, Tatsuo
AU - Iwasaki, Hiroshi
PY - 1994
Y1 - 1994
N2 - We studied kinetic roughening of copper which was electrodeposited at slow rates. The surfaces showed a unique scaling. In the shorter length regime, the interface width scaled with the length scale L as L (=0.870.05). In the longer length regime, the width scaled with the deposition time t as t(=0.450.05). The value of +, 2.8, is much larger than 2 predicted for the case where the growing direction is normal to the surface everywhere. The scaling behavior is interpreted as the result of enhanced growth of the protrusions owing to nonlocal Laplacian growth effect.
AB - We studied kinetic roughening of copper which was electrodeposited at slow rates. The surfaces showed a unique scaling. In the shorter length regime, the interface width scaled with the length scale L as L (=0.870.05). In the longer length regime, the width scaled with the deposition time t as t(=0.450.05). The value of +, 2.8, is much larger than 2 predicted for the case where the growing direction is normal to the surface everywhere. The scaling behavior is interpreted as the result of enhanced growth of the protrusions owing to nonlocal Laplacian growth effect.
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U2 - 10.1103/PhysRevLett.72.4025
DO - 10.1103/PhysRevLett.72.4025
M3 - Article
AN - SCOPUS:3843097927
VL - 72
SP - 4025
EP - 4028
JO - Physical Review Letters
JF - Physical Review Letters
SN - 0031-9007
IS - 25
ER -