Stable growth and kinetic roughening in electrochemical deposition

Atsushi Iwamoto, Tatsuo Yoshinobu, Hiroshi Iwasaki

Research output: Contribution to journalArticlepeer-review

85 Citations (Scopus)

Abstract

We studied kinetic roughening of copper which was electrodeposited at slow rates. The surfaces showed a unique scaling. In the shorter length regime, the interface width scaled with the length scale L as L (=0.870.05). In the longer length regime, the width scaled with the deposition time t as t(=0.450.05). The value of +, 2.8, is much larger than 2 predicted for the case where the growing direction is normal to the surface everywhere. The scaling behavior is interpreted as the result of enhanced growth of the protrusions owing to nonlocal Laplacian growth effect.

Original languageEnglish
Pages (from-to)4025-4028
Number of pages4
JournalPhysical review letters
Volume72
Issue number25
DOIs
Publication statusPublished - 1994
Externally publishedYes

ASJC Scopus subject areas

  • Physics and Astronomy(all)

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