Spray coated photoresist over anisotropically etched deep Si cavities

V. K. Singh, M. Sasaki, Jong Hyeong Song, K. Hane

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Up to now, we have demonstrated the lithography on the anisotropically wet-etched Si cavities and optical fiber ends. However the fundamental understanding or detailed data relating to the performance of the three-dimensional lithography are not clear. In this study, the photoresist thickness distribution is examined changing the resist drying condition.

Original languageEnglish
Title of host publication2002 International Microprocesses and Nanotechnology Conference, MNC 2002
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages188-189
Number of pages2
ISBN (Electronic)4891140313, 9784891140311
DOIs
Publication statusPublished - 2002 Jan 1
EventInternational Microprocesses and Nanotechnology Conference, MNC 2002 - Tokyo, Japan
Duration: 2002 Nov 62002 Nov 8

Publication series

Name2002 International Microprocesses and Nanotechnology Conference, MNC 2002

Other

OtherInternational Microprocesses and Nanotechnology Conference, MNC 2002
CountryJapan
CityTokyo
Period02/11/602/11/8

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering

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  • Cite this

    Singh, V. K., Sasaki, M., Song, J. H., & Hane, K. (2002). Spray coated photoresist over anisotropically etched deep Si cavities. In 2002 International Microprocesses and Nanotechnology Conference, MNC 2002 (pp. 188-189). [1178607] (2002 International Microprocesses and Nanotechnology Conference, MNC 2002). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/IMNC.2002.1178607