Solid state diffusion bonding of doped tungsten alloys with different thermo-mechanical properties

Shuhei Nogami, Hiroyuki Noto, Michitoshi Toyota, Takaya Hattori, Kohei Otomo, Akira Hasegawa

Research output: Contribution to journalArticle

1 Citation (Scopus)

Abstract

To develop joints using W materials with different thermo-mechanical properties, solid state diffusion bonding involving two different W materials (pure W, K-doped W, or K-doped W-3%Re) and using a pure V interlayer (1.5 mm, 0.5 mm, or 0.05 mm thick) were carried out at 1250 °C for 1 h. The use of a thin interlayer was found to be effective from the point of optimizing the strength and thermal diffusivity. Diffusion bonding at lower temperatures or utilizing W materials with higher recrystallization temperatures were also determined to be effective because pure W can recrystallize at 1250 °C. Further evaluation of a wide range of interlayer thicknesses and thermo-mechanical test conditions is necessary based on the present work to obtain optimum W/V/W joints.

Original languageEnglish
Pages (from-to)76-81
Number of pages6
JournalFusion Engineering and Design
Volume136
DOIs
Publication statusPublished - 2018 Nov

Keywords

  • Potassium doping
  • Rhenium addition
  • Solid state diffusion bonding
  • Tensile strength
  • Thermal diffusivity
  • Tungsten

ASJC Scopus subject areas

  • Civil and Structural Engineering
  • Nuclear Energy and Engineering
  • Materials Science(all)
  • Mechanical Engineering

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