Solderability of bulk metallic glasses using lead-free solders

Hiroshi Nishikawa, Krit Wong Piromsarn, Hiroya Abe, Tadashi Takemoto, Mikio Fukuhara, Akihisa Inoue

Research output: Contribution to journalArticlepeer-review

11 Citations (Scopus)


A feasibility study has been conducted to determine whether the low temperature joining process such as soldering process and wire bonding process can be applied to join a bulk metallic glass (BMG) to a BMG and a BMG to a crystalline metal. Therefore, in order to evaluate the solderability of BMGs, the spread test of the solder was basically performed for three kind of BMGs in this study. As a result, Pd-based BMG exhibited a good wetting behavior of the solder at 503 K and 523 K. On the other hand, concerning Cu-based and Zr-based BMGs, there was no wetting of the solder on the surface of BMGs regardless of the peak temperature. Then the ultrasonic soldering process was tested to establish the joint process for BMGs. It was clear that the application of ultrasonic is effective to the soldering process.

Original languageEnglish
Pages (from-to)1326-1329
Number of pages4
JournalMaterials Transactions
Issue number6
Publication statusPublished - 2009 Jun


  • Bulk metallic glass
  • Intermetallic compound
  • Lead-free solder
  • Solderability
  • Ultrasonic soldering
  • Wetting behavior

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering


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