Sn-Cu thin film transient liquid phase bonding test with different underlayers using fully-in-vacuum wafer aligner/bonder

K. Hikichi, S. Matsuzaki, Y. Nonomura, H. Funabashi, Y. Hata, M. Esashi, S. Tanaka

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

Abstract

This paper compares different diffusion barriers for thin film transient liquid phase (TLP) bonding. Thin film TLP bonding has some advantages such as low process temperature and a large tolerance of bonding surface roughness. However, metal diffusion phenomena in TLP bonding is so complicated that bonding strength is dependent on metal systems. In this study, Sn-Cu TLP system was selected and its bonding strengths with several diffusion barriers were evaluated by die shear test. The microstructure of the bonded metal part was examined by scanning electron microscopy and energy dispersive X-ray spectrometry. The diffusion barriers of multilayered Cu/Cr, Cr-Cu and Ni worked, and the best bonding strength was obtained using Au/Sn/Cu/Cr-Cu/Cr metal system (10/200/1000/100/100 nm), where Cu thickness is doubled compared with the other samples. This paper also describes a new wafer bonder in which alignment, surface treatment and bonding can be performed without breaking vacuum.

Original languageEnglish
Title of host publication2013 Transducers and Eurosensors XXVII
Subtitle of host publicationThe 17th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS and EUROSENSORS 2013
Pages1071-1074
Number of pages4
DOIs
Publication statusPublished - 2013
Event2013 17th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS and EUROSENSORS 2013 - Barcelona, Spain
Duration: 2013 Jun 162013 Jun 20

Publication series

Name2013 Transducers and Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS and EUROSENSORS 2013

Other

Other2013 17th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS and EUROSENSORS 2013
CountrySpain
CityBarcelona
Period13/6/1613/6/20

Keywords

  • Copper tin
  • Diffusion barrier
  • Shear bonding strength
  • Transient liquid phase (TLP) bonding
  • Wafer-level packaging

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering

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