Smart vision chip fabricated using three dimensional integration technology

H. Kurino, M. Nakagawa, K. W. Lee, T. Nakamura, Y. Yamada, K. T. Park, M. Koyanagi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

7 Citations (Scopus)

Abstract

The smart vision chip has a large potential for application in general purpose high speed image processing systems. In order to fabricate smart vision chips including photo detector compactly, we have proposed the application of three dimensional LSI technology for smart vision chips. Three dimensional technology has great potential to realize new neuromorphic systems inspired by not only the biological function but also the biological structure. In this paper, we describe our three dimensional LSI technology for neuromorphic circuits and the design of smart vision chips.

Original languageEnglish
Title of host publicationAdvances in Neural Information Processing Systems 13 - Proceedings of the 2000 Conference, NIPS 2000
PublisherNeural information processing systems foundation
ISBN (Print)0262122413, 9780262122412
Publication statusPublished - 2001
Event14th Annual Neural Information Processing Systems Conference, NIPS 2000 - Denver, CO, United States
Duration: 2000 Nov 272000 Dec 2

Publication series

NameAdvances in Neural Information Processing Systems
ISSN (Print)1049-5258

Other

Other14th Annual Neural Information Processing Systems Conference, NIPS 2000
Country/TerritoryUnited States
CityDenver, CO
Period00/11/2700/12/2

ASJC Scopus subject areas

  • Computer Networks and Communications
  • Information Systems
  • Signal Processing

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