Abstract
Sensors fabricated based on MEMS technology are described. Capacitive pressure sensors were fabricated by wafer-level packaging. Electrostatically levitated rotational gyroscopes have been developed for high-precision inertia measurement systems. Tactile sensor networks driven by event are under development for safe nursing robots. Acoustic sensors for wireless sensing, optical scanners for 3D imaging, sensors at the end of a catheter in a blood vessel and microprobes with high spatial resolution and high sensitivity have been developed as well.
| Original language | English |
|---|---|
| Title of host publication | Intelligent Integrated Systems |
| Subtitle of host publication | Devices, Technologies, and Architectures |
| Publisher | Pan Stanford Publishing Pte. Ltd. |
| Pages | 435-458 |
| Number of pages | 24 |
| ISBN (Electronic) | 9789814411431 |
| ISBN (Print) | 9789814411424 |
| DOIs | |
| Publication status | Published - 2014 Apr 30 |
ASJC Scopus subject areas
- Engineering(all)
- Materials Science(all)